Electronics Manufacturing

Contract Electronics Assembly & Design Services


General Capabilities (Lead & ROHS):

  • SMT & through hole assembly
  • Programmable Selective soldering
  • Wave soldering up to 16" wide
  • X-Ray inspection

SMT Vision Limits:

  • Board size 20" X 20" standard
  • Component size: 0201 standard
  • QFN / micro BGA / IC pin pitch: 0.3mm (12 mil)

Project Types:

  • You provide boards, parts kit, parts layout, test spec's etc. and we build / test.
  • Turnkey projects - you provide files and test spec's - we supply parts, build / test.
  • Custom project arrangement to suit your needs.
  • Give us a schematic, an approximate board layout, and or enclosure details and we can do the rest to provide you with a quality product complete with packaging. Alternatively we have in house capability to design from concept to finished product.

Testing Capability:

We have a core of skilled people who can handle most types of testing. Our specialties include analog, digital and RF testing.

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